by SemiTom on 11/22/20, 5:20 AM with 10 comments
by ericpauley on 11/23/20, 3:23 AM
In [1], they propose timing artifacts in FPGAs as a means to achieve this. I imagine that some of the random material embeddings in the article may achieve this in practice, though it's important to actually quantify it.
[1] https://citeseerx.ist.psu.edu/viewdoc/download?doi=10.1.1.29...
by crispyambulance on 11/23/20, 11:57 AM
What happens during AOI is that a camera images every part of the PCB and then uses old school machine vision to identify problems like missing/misplaced/misoriented components, wrong parts, solder mishaps, and contamination/foreign-objects. In practice, it's not perfect, but it can detect gross problems and is valuable in high-volume or high-cost pcb's. The images are usually not stored, but processed "on the fly" by machine vision applications.
It's good to hear that Alitheon is taking this to the next level. As a MFG engineer, I've long felt that AOI has been under-utilized. There are multiple reasons to more fully analyze these images besides security concerns and given the low cost of storage, I think it's becoming not unreasonable to store entire imagesets of individual high-cost PCB's for the life-span of the product.
As for the big-picture of security, however, it really begins earlier in the supply chain before the components even arrive at the factory in reels. By the time that something gets to a factory, one can't do much more than read-out things like id's and perform functional screens. That's why manufacturers have, sometimes, long qualification processes before they even consider a new component or its vendor.
by pabs3 on 11/23/20, 6:52 AM
by userbinator on 11/23/20, 2:13 AM
by m463 on 11/23/20, 1:43 PM